The ADI Team Congress 2019 will take place at the EICC in Edinburgh from the 2nd to the 4th of May. Under the slogan “Shaping the future of dental implantology: techniques – technology – teamwork”, the congress will explore current topics and look to the future to discover what is coming next in the world of oral implantology.
The event is organised by the Association of Dental Implantology (ADI), one of the UK’s leading dental associations, with more than 30 years of experience and more than 2250 members. This event is considered one of the most important dental implantology meetings in Europe, combining internationally recognised speakers, specific programmes for technicians, hygienists and students, as well as corporate forums.
The oral implantology industry will be one of the key points of this meeting. The exhibition will include a number of leading implant companies and corporate forums will be an opportunity to discuss important developments in the dental implant field.
ZIACOM will hold stand number 23 for the event, where the most outstanding products will be exhibited. The conical connection dental implants, Galaxy and ZV2 as well as the internal connection implants, Zinic, Zinic MT and the extra short Zinic Shorty, will be some of the products that will be highlighted at the ZIACOM stand.
The range of biomaterials ZIACOM, Osseos BCP and Osseos TCP (bone regenerators) and Zellplez and T-Gen (reabsorbable membranes), will also have an outstanding place in the stand, presenting such amazing features that place them as one of the best synthetic regenerators in the dental industry.
The combination of intraoral scanning with Carestream’s CS 3600 intraoral scanner and guided surgery by using the Zinic 3D planning software is another important aspect for ZIACOM during its presence in Edinburgh. This ideal combination reduces the number of events that may occur during implant surgery in the dental practice to the lowest level.
Check out all the new products that ZIACOM is preparing for this huge event at stand 23.